Bulletin of ANPA

Abstract submitted to ANPA Conference July 14–16, 2023

Volume 5, Number 1

Condensed Matter Physics and Material Science

Abstract ID: ANPA2023-N00056

Abstract:

ANPA2023-N00056: WaitingSemiconductor Materials for Photonic and Electronic Applications

Authors:

• Tom N. Oder; Department of Physics and Astronomy, Youngstown State University, One University Plaza, Youngstown, OH

Semiconductor materials have played a huge role in advancing today’s technology through the electronic and photonic devices ushered in over the years. Since about 1990s, wide bandgap compound semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) were the focus of research and development to complement and sometimes replace devices based on silicon (Si), germanium (Ge) and gallium arsenide (GaAs) materials. This rapid development was driven in part by society’s growing needs for devices to handle higher power, higher temperature and higher frequency. Current research efforts are expanding to ultra-wide bandgap semiconductors such as AlGaN, diamond, BN, Ga2O3 and oxide-based materials. In this talk, I will highlight our past work on the III-nitride materials for photonic applications including improvement of light extraction using photonic crystals. I will then present results of our recent work on SiC Schottky barrier diodes for high temperature and high-power electronic applications. The Schottky diodes were fabricated using a variety of rectifying contacts including refractory metal diborides, Ni, Ti and Mo. I will also present results from our efforts on oxide semiconductor materials including ZnO and Ga2O3, where we are investigating the microstructure and optical properties of the thin films deposited and processed under various conditions. The overall goal of our work is to realize the unique advantages expected from the theoretically predicted properties of these (ultra) wide bandgap semiconductor materials.

To cite this abstract, use the following reference: https://anpaglobal.org/conference/2023/ANPA2023-N00056